The previous report had claimed that the Snapdragon 1000 may include Cortex A76 performance cores and lightweight Cortex A55 cores. This processor is being produced to compete with the low-end U and Y-series processors from Intel.
The most important information that Quandt uncovered came from the LinkedIn profile of a Microsoft Windows Multimedia Project Engineer, which mentioned "test operations on Qualcomm Snapdragon premium tier chipset SDM845 and SDM1000 for desktop, Andromeda and HoloLens AR/VR/mixed reality products".
Now here is something very interesting to note; the Snapdragon 1000 is reportedly not completely soldered on the mainboard but features its very own special socket like Intel and AMD motherboards are made for desktop systems.
Qualcomm has unravelled a line-up of "Always-Connected PC" that were equipped with the Snapdragon 835 processor and the Windows 10 in December past year. Latest reports also indicate that Qualcomm has a test bench running the Snapdragon 1000 processor, alongside 16GB of RAM, 256GB of storage, Gigabit WiFI and a power management chip. That came to us in the form of the interestingly named Snapdragon 850 - a mere 5 digits higher than the 845, a chip which now graces top-end Android smartphones, such as the OnePlus 6, and Samsung Galaxy S9.
The Snapdragon 1000 is said to have a 6.5W power draw for the CPU and a total 12W draw for the entire SoC. This means, the Qualcomm chipset will be contending against the entry-level Intel chipsets like the U series, which powers the devices like the Apple MacBook.
How much the Snapdragon's 1000 boosted specs are going to compromise those advantages remains to be seen - we still don't know any of the key specs of the chip, even if it's now looking more likely to be on the way. Now, details of a chip named the SDM1000 (which is already being referred to as the Snapdragon 1000) have surfaced.